Weightless Mobility - Designed for Lighter and Slimmer Mobile Personal Electronics Systems

Whether for your briefcase or schoolbag, the VIA C3®-M processor is designed to reduce the weight and thickness of mobile systems because to VIA, mobility means "easy to carry".

The VIA C3®-M processor is based on VIA's highly efficient CoolStream™ architecture, enabling it to run exceptionally cool and making it possible to use low profile, smaller and lighter cooling mechanisms that result in lighter, slimmer notebook system designs.

The VIA C3®-M comes in an Enhanced Ball Grid Array (EBGA) package that spreads the thermal energy of the processor over the full surface area of the processor, allowing for even lighter, lower profile processor coolers. The EBGA package helps to further reduce the thickness of VIA C3®-M systems because it measures a mere 1.525mm in height and is mounted directly onto the mainboard, unlike other processors that require a raised socket to hold them in place.

Mobile device batteries are among the heaviest and bulkiest components in the whole system. VIA CoolStream architecture reduces power consumption, allowing VIA C3®-M systems to run with fewer or smaller and lighter batteries.