VIA Embedded at MEDC Japan 2007
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Meguro Gajoen, Tokyo, Japan
June 6, 2007 |
Microsoft Mobile & Embedded DevCon (MEDC) is the most anticipated industry event of the year, where you'll obtain the latest information for building and bringing to market the next wave of devices, applications, content and services for the Windows® Mobile and Windows Embedded platforms.
Join VIA at MEDC Japan to see the exciting pace of miniaturization and integration making the x86 platform more accessible to the embedded market. You will get the opportunity to see the remarkable size reduction for small form factor mainboards and rich integration VIA has achieved to maintain leadership in enabling a whole range of new computing possibilities.
Leveraging leading performance per watt, ultra low power consumption and feature rich design of the VIA embedded processor platform, VIA continues to define small form factor mainboards through its EPIA Mini-ITX, Nano-ITX and Pico-ITX mainboards.
Designed as platforms for innovation in x86 system design, the VIA EPIA family of mainboards is available in a growing number of configurations and feature sets, and is available from VIA Embedded channel partners worldwide.
To learn more about MEDC 2007 please click |
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