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VIA at Spring IDF 2006

Intel Developer Forum
San Francisco, USA - March 7-9
Moscone Center West

At Spring IDF 2006, VIA will again be on hand to demonstrate the latest additions to its range of high performance, feature rich platform solutions for the Intel Pentium 4 processor at the Moscone Convention Center West in San Francisco, California.

Among the products on display at the VIA booth will be a sneak preview of the new VIA PT900 chipset, VIA’s latest advanced PCI Express chipset solution for the Intel® Pentium®4 processor platform. Supporting dual graphic card implementations, the VIA PT900 demo will highlight dual S3 Graphics Chrome S27 Graphics cards with MultiChrome™ technology, the industry's only open platform and cable free multi-graphics implementation. Other technology demonstrations include the VIA P4M890 desktop IGP chipset with PCI Express connectivity and flexible DDR/DDR2 support.


VIA Booth Location
VIA Booth Location: #938
IDF Spring Floor Plan
   

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