VIA at Embedded Systems Expo & Conference in Tokyo

Tokyo, Japan June 28~30, 2006

Tokyo Big Sight, Booth no. 12-30

Embedded Systems Expo & Conference is the leading embedded systems exhibition in Japan. This year, VIA invites you to join us in Tokyo at the Tokyo Big Sight, and see how VIA is leading the way in miniaturization and integration for x86 platforms in the embedded market.

At booth 12-30, VIA will showcase the latest technologies that incorporate our market-leading power efficient CPUs, feature rich chipsets for which VIA is renowned for, that are enabling ever-smaller, ever-cooler embedded systems. We will also be demonstrating exciting new mainboard products and partner systems that illustrate how our technologies are enabling customers’ innovation with applications ranging from digital signage, POS, thin clients, car-PC to robots.

Please join us at 12-30 to see the latest innovative platform solutions specifically designed for the embedded market.

For more information on ESEC please click here.