VIA Showcases the Modular Approach for Embedded Solutions at the "Boards & Solutions Conference"

Boards & Solutions Conference May 12, 2011 NH Hotel, Munich

VIA welcomes you to join us at Boards & Solutions Conference 2011. VIA will be discussing "Embedded Building Blocks – A Modular Approach" with a focus on helping embedded designers to choose the most ideal form factor for their applications.

At the conference, VIA will have a table-top exhibit demonstrating our latest small form factor and modular solutions including embedded boards based on COM Express™, Qseve™ and Em-ITX form factors. VIA's powerful small form factor solutions help you to make a statement for a fraction of the cost using a combination of single or multi-core x86 CPUs with VIA's VX900 integrated chipset or the latest S3 Graphics 5400E Embedded GPU.

VIA's first ARM based industrial tablet PC will also be shown. VIA is the only company worldwide with both ARM and x86 licenses offering truly comprehensive embedded board and system hardware solutions with up to 7 years of product lifecycle for various applications.

See how you don't have to sacrifice your feature offerings by using the best performance per watt, power efficient small form factor hardware solutions available in the market today.

For more information about Boards & Solutions Conference 2011, click here.