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VIA Initiatives

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» Green Computing
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» VIA Connected Client Initiative
» VIA PadLock Security Initiative
» VIA Robotics Initiative
» VIA Spearhead Initiative

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VIA Initiatives

VIA is always looking at ways to improve the user experience, both on a product design level and in promoting system and application innovation among our partners to expedite the development of exciting new ideas.

Through a series of strategic initiatives, VIA aims to drive the proliferation of creative products and applications that can enhance the technology experience and the quality of life, as the x86 platform rapidly emerges as the heart of the digital lifestyle.


» VIA Green Computing Initiative
An evangelist of quiet computing, power efficiency and the elimination of hazardous materials in manufacturing since 2001, VIA is striving to become the first IC vendor to comply with international lead-free standards across the silicon platform, and is working with other leaders in Green Computing to develop sustainable environmentally friendly technology models.
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» VIA pc-1 Empowered Connectivity Initiative
Solving the digital divide is a fundamental goal for many emerging markets, and the VIA pc-1 Initiative is a realistic approach to empowering millions of people through technology within a sustainable business framework.
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» VIA Connected Client Initiative
Helping enterprise successfully manage I.T. in the face of so many serious challenges, the VIA Connected Client Initiative has been launched to educate enterprise on practical, cost effective solutions centered around thin clients and other connected client devices.
» Learn More.

» VIA PadLock Security Initiative
Combating the onslaught of PC security issues with a holistic approach encompassing extensive suites of world-leading hardware and software technologies, the VIA PadLock Security Initiative is creating a robust platform infrastructure for all x86 markets, from desktop and mobile PCs to digital entertainment and embedded devices.
» Learn More.
» VIA Robotics Initiative
Close cooperation between the software, hardware and engineering communities is driving innovation in the fast-emerging market for robotics, with VIA’s platform solutions leading the way in extending digital intelligence to the consumer market.
» Learn More.

» VIA Spearhead Platform Initiative
This initiative provides, in the form of intelligent silicon platform and system reference designs, complete interoperable platform solutions for system builders to reduce costs and expedite development of smarter digital devices for specific emerging and burgeoning markets.
» Learn More.


Resources

World's First Lead-free VIA Eden Platform Based Mainboard
VIA and Yamashita press release
Next Generation C5J Esther Processor Core With Advanced Features For Securing E-Commerce Transactions
VIA C5J Esther processor core press release
Software Development Kit assists third party developers in integrating support for the VIA PadLock Hardware Security Suite
VIA PadLock SDK press release
Highlights From DARPA Grand Challenge 2004
A look at some of the contenstants at the Darpa Grand Challenge... » Download Video!
VIA presents DARPA Grand Challengers, Team LoGHIQ
Team LoGHIQ is made up of the Cabes family and a small band of young graduates of the Rensselaer Polytechnic Institute... » Download Video!

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