Embedded Systems Conference 2006

Boston, MA, USA Sept. 25-28
Hynes Convention Center, Booth 601

Join VIA at the Embedded System Conference 2006 at the Hynes Convention Center and see how VIA is leading the way in miniaturization and integration on the x86 platform for the embedded market.

At booth 601, VIA will showcase the latest technologies that incorporate the market-leading power efficiency, extended connectivity and rich feature sets for which VIA is renowned, that are enabling ever-smaller, ever-cooler embedded systems.

Underlining VIA's leadership in miniaturization and integration will be brand new silicon targeted specifically at the embedded market, as well as the ultra compact VIA EPIA mainboards, including the latest VIA Nano-ITX and Mini-ITX platforms, all of which bring rich digital media capabilities to ever smaller form factors.

On the processor side, VIA boasts the strength and momentum of the transition to the VIA V4 bus, and how the performance-per-watt-leading VIA C7 and VIA Eden processors are proving the cornerstone of this new generation of more flexible, more compact and more feature-rich embedded systems. Together with the newly announced VIA CX700 digital media IGP chipset that integrates all the cutting-edge features of modern day North and South bridges, including rich video graphics, HD audio, and DDR2 and SATA II support, into a single, compact and highly power-efficient package, VIA boasts the most attractive platform solution for embedded applications.

Please join us at Booth 601 to see the exciting VIA platforms and partner systems that illustrate how our technologies are enabling customers’ innovation in applications ranging from digital signage, media center, thin clients to car-PC.

For more information on ESC Boston please click here